This Lead free solder paste has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. The superior wetting ability of the paste (NC257-2) results in bright, smooth and shiny solder joints, and it has been specifically formulated to lower solder beading. It also offers very low post process residues, which remain crystal clear and easily probed. This solder paste offers a chemistry developed for use in air reflow, as well as providing slump and humidity tolerances to extend the useable life in facilities where environmental control is not at its optimum. 15g Syringe.
Please Note: We recommend that this product is stored in a cool space, not in a shed or tool box in hot temperatures. As we store it in fridges in-store we also recommend waiting until the product reaches room temperature to use it for optimal use.